Globalfoundries
SMTS Process Module Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)
Singapore
Mid-level
POSTED 7 OCTVERIFIED 30M AGO
35 days opentrue age
Past the 14d median close
- Reopened
- ×2
SGD 98k–SGD 271kno pay posted
- Market p25–p75
- SGD 98k–SGD 271k
870open roles
- Opened · 30d
- +82
- Closed · 30d
- −1,402
1,727open · Mid-level Software engineering
- Opened · 7d
- +1287% of open
- All software engineering
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