Development, prototyping and manufacturing of EC-QCL setups with advanced optical components.
Responsibility for wire bonding, die bonding, glueing and soldering processes.
Definition of SOPs for assembly, optical alignment, packaging and quality control.
Modification of electronic components on existing driver electronics.
Close collaboration with physicists, technicians, engineers, scientists, and developers.
You report to the CTO and are embedded in a team with support by technical assistants.

At least three to five years professional experience in a similar position in a company / startup.
Expert knowledge and hands-on experience in semiconductor laser packaging, bonding, and alignment.
Expert knowledge of important laser parameters and their characterization techniques.
Good knowledge of semiconductor physics, optics and the electronic fundamentals of laser drivers.
You are a hands-on, pragmatic and solution-oriented engineer with intrinsic motivation.
You take ownership, communicate clearly and are willing to walk the extra mile.
A thorough and independent work ethic, reliability, and team spirit.
Ability to work on-site in Adlershof (no remote work) with an existing work permit for Germany.
Proficiency in German and English.

Contribute to cutting-edge tech development for a truly meaningful product.
Learn from an excellent team of experienced scientists, engineers, and software developers.
Enjoy a start-up atmosphere with room for ideas, an open corporate culture and a diverse, international team.
Strong coffee, refreshing drinks, healthy snacks, and sweet treats.
A competitive salary based on your experience.