Omni Design is working on exciting solutions and chips for next generation automotive and space applications and looking for talented and capable engineers.

Omni Design is developing exciting high-speed Mixed-Signal SOC. We are looking for a Lead/Manager of Physical Design to make these high performance Mixed-Signal SOCs a reality

Role and Responsibility

Own and drive the physical implementation of next-generation Mixed-Signal SOC with HS ADC/DAC, HS interfaces like PCIe, LPDDR, MIPI, USB2/3, Gig Ethernet etc.
Understand the requirements and define physical implementation methodologies.
Collaborate with architecture, design, front end and CAD teams to deliver high-quality physical designs.
Implement and verify designs at all levels of hierarchy in the SOC.
Interact with foundry over matters of technology, schedule, and signoff

Qualifications and Experience

BSEE Required, MSEE Preferred
8+ years of experience of physical design in SOCs.
3+ years of experience in managing projects and leading teams.
Hands-on expertise in all of the following areas: Floorplanning, Power planning, Implementation of UPF Methodology, Logic and clock tree synthesis, Placement , Timing Closure, Routing, Extraction, Physical Verification (DRC & LVS), Crosstalk Analysis, EM/IR
Full chip/ top-level expertise in multiple chip tape-outs.
Good understanding and experience in SCAN, BIST, and ATPG.
Strong background in TCL/Perl/Python programming is a must.
Expertise in double patterning process nodes is desirable. Experience with sub 40 nM nodes required
Expertise in Cadence or Synopsys RTL-to-GDSII flow is preferred.

Expectations

Do the FC Floor Plan and Layout
Set up the EDA tools and develop the scripts
Develop the UPF methodology
Implement the Power, Clock Grid
Generate the SDF files
Do the DRC, ERC, LVS, SI and Cross talk checks, Do the DFM checks
Tapeout the chip
Manage and mentor the PD and custom layout team
Make changes, as needed to the custom layout of the IP
Release the GDS2 to the Fabs