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Astera

Senior Principal Photonics Test Engineer

San Jose, California, United States; San JoseUnited States
Principal · Optical
POSTED 19 MAY
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Pay · Astera
$139k–$186k
p25–p75 · n=3
Open for
170d
closes ~53d here
H-1B · FY26
1
certified LCAs
Hiring · 30d
179
−1 net · open roles
PythonC++

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com.

Job Summary

We are seeking a highly technical and hands-on Senior Principal Photonics Test Engineer to serve as the technical authority for photonics test engineering across our product portfolio. This role will define end-to-end test architectures and drive advanced test development for silicon photonics devices, subsystems, and optical modules from early R&D through high-volume manufacturing.

The ideal candidate brings deep expertise in silicon photonics test methodologies, strong system-level thinking, and a proven ability to solve complex yield and performance challenges while building scalable, automated test solutions.

Key Responsibilities

  • Define and own the end-to-end test architecture and test roadmap including wafer-level testing, package-level validation, optical engine and module characterization, as well as production and reliability testing.
  • Lead the development of advanced wafer probe and package-level test solutions for silicon photonics devices and subsystems.
  • Architect and implement automated test flows for engineering characterization, validation, and production.
  • Design, develop, and implement optical test plans and procedures for co-packaged optics modules, including silicon photonics engines, laser sources, photodetectors, and optical fiber connectors.
  • Debug and resolve yield issues and critical technical challenges, including electrical/optical performance failures, process & test induced variations.
  • Develop and drive the hardware and software roadmap for next-generation optical test systems.
  • Collaborate across cross-functional organizations such as silicon and photonics design teams, packaging, validation, reliability and qualification teams.
  • Define and implement test and yield analytics frameworks to accelerate yield learning and root cause identification.
  • Provide deep technical input in Design-for-Test (DfT) and product development reviews.
  • Define test specifications, acceptance criteria, and pass/fail limits based on IEEE, OIF, and internal standards

Required Qualifications

  • MS or PhD in Electrical Engineering, Optics, Physics, Semiconductor Engineering, or a related field.
  • 10+ years of experience in optical testing, photonic device characterization, or optical transceiver module test.
  • Strong understanding of silicon photonics devices (modulators, photodetectors, multiplexers, grating couplers, edge couplers), optical probing and fiber coupling, Electro-Optical (EO) characterization, high-speed optical testing and BER measurement.
  • Proven experience leading development of wafer-level and package-level optical test systems.
  • Programming skills in Python, MATLAB, LabVIEW, or C/C++ for test automation
  • Knowledge of optical communication standards (IEEE 802.3, OIF-CEI, CMIS)
  • Familiarity with statistical analysis methods and data visualization tools. Strong experience debugging yield issues and complex system-level problems.
  • Excellent collaboration and communication skills, with the ability to influence across engineering disciplines.

Preferred Qualifications

  • Experience specifically with co-packaged optics or on-board optics architectures.
  • Knowledge of 2.5D/3D packaging technologies (interposers, chiplets, UCIe etc.).
  • Experience with external laser source (ELS) integration and characterization.
Source · AsteraFirst seen 2 NovOriginal ↗