Role Title: Staff Engineer - Advanced Packaging Multiphysics Physics Modeling (Mechanical- Electrical Co-Simulation)

Job Title: Staff Engineer - Advanced Packaging Multiphysics Physics Modeling

Location: Covington, GA

Job Type: Full-Time

Job Description

This role owns the simulation, modeling and interpretation of Multiphysics behavior across advanced packaging architectures from die level interconnects through buildup layers to system-level integration. The engineer will build and validate predictive models for mechanical (stress, warpage, fatigue, delamination, cracking, SeWaRe) and electrical (signal/power integrity, thermal-electrical coupling) performance, translating simulation output into design rules and go/no-go decisions for process and product teams. Core work spans finite element analysis (FEA) of interlayer/interface stresses, material characterization and constitutive modeling, failure mode prediction (crack initiation, delamination, via cracking, SeWaRe type reliability failures), and RDL/buildup layer mechanical-electrical co-optimization, closing the loop between simulation predictions and physical failure analysis/reliability test data.

Required Skills

FEA modeling (ANSYS, Abaqus, or COMSOL) for stress/strain, thermos-mechanical and fracture mechanics analysis in multilayer stacks
Interface/interlayer stress and delamination modeling (cohesive zone modeling, VCCT, traction-separation laws)
Material property characterization, and modeling for polymers (dielectrics, mold compounds) metals, (Cu, Ti seed), and glass/ceramic substrates – CTE mismatch, viscoelasticity, plasticity
Working knowledge of RDL buildup layer, and interposer architectures (organic, glass core) and their process induced stress states
Failure mode analysis tied to package reliability (thermal cycling, SeWaRe, drop/shock, warpage) with ability to correlate simulation to physical failure analysis (SEM, CSAM, cross-section)
Electrical performance simulation basics – signal/power integrity or coupled electro-thermal-mechanical modeling
Strong grasp of semiconductor packaging unit processes (lithography, plating, etch) and how they introduce residual stress
Scripting/automation for parametric studies (Python, MATLAB, or APDL/Abaqus scripting)
Ability to translate simulation results into actionable design rules for process/product engineering teams

Preferred Skills

Experience with panel level packaging reliability prediction
Exposure to system-level (board + package + die) co-simulation
DOE/Statistical methods for correlating simulation with experimental reliability data
Familiarity with glass core interposer or 2.5D/3D heterogenous integration mechanics
Experience with machine learning assisted surrogate modeling for faster design space exploration

Education

PhD or equivalent industry experience in mechanical engineering materials science, or semiconductor device physics

Benefits:

401K 6% matching (NO vesting period)
Healthcare 100% support (Health, Dental, Vision)
Life, STD, LTD 100 % support
Cell phone allowance
PTO and self-development

SALARY

$90,000 – $150,000