# Principal Mechanical Engineer at Lumilens > Onsite · India · Principal · Software engineering · open. Source: https://alderhq.app/jobs/ashby%3Alumilens%3A74fa6578-aa5f-43fc-b69e-a699bdf6e91e (read 2026-11-13). ## Facts (observed) - Company: [Lumilens](https://alderhq.app/companies/lumilens) - Location text: Bengaluru, India - Where it can be done from (inferred): Onsite · India (evidence: "Location lists "bengaluru"") - Posted: 2026-06-12 (154 days ago) - First seen by alder: 2026-11-07 · last verified: 2026-11-08 - Reposted: 0 times · edited: 0 times - Apply on the employer's site: https://jobs.ashbyhq.com/lumilens/74fa6578-aa5f-43fc-b69e-a699bdf6e91e ## Pay and sponsorship - Posted pay: not posted - Market band for similar posted roles (Bengaluru, n 3): p25 ₹84.3L, median ₹98.5L, p75 ₹98.5L ## Description (the employer's text) ### Principal Mechanical Engineer – OSFP Module Design ### About Lumilens At Lumilens, we are building the critical photonics infrastructure that powers tomorrow’s AI supercomputing. From chip-to-chip optical interconnects to scalable photonic engines, Lumilens is unlocking a new era of computing—faster, cooler, and massively more efficient. Join our experienced team to help shape the next generation of high-speed optical connectivity. ### Position Summary We are seeking an experienced Principal Mechanical Engineer to lead the architecture, design, development, and industrialization of next-generation high-speed optical transceiver modules, including 800G, 1.6T, and future pluggable platforms based on the OSFP ecosystem. This role requires deep expertise in high-speed electro-mechanical packaging, thermal management, precision tolerance engineering, EMI/EMC compliance, materials engineering, and large-scale manufacturing/NPI execution. You will work cross-functionally with optics, signal integrity, electrical, thermal, manufacturing, reliability, and supplier teams to deliver high-performance products at hyperscale production volumes. ### Key Responsibilities Lead end-to-end mechanical design and development of OSFP transceiver modules and related hardware Define module architecture, stack-up strategy, mechanical interfaces, retention mechanisms, heat spreaders, cages, and thermal paths Design precision components using sheet metal, die castings, injection molded plastics, CNC machined parts, and TIMs Optimize designs for thermal performance, structural integrity, EMI shielding effectiveness, manufacturability, reliability, and cost Drive advanced thermal solutions for high-power DSP and optical engines (Optional) Perform thermal simulations using FloTHERM, Icepak, and CFD tools Develop cooling strategies involving heat sinks, vapor chambers, heat spreaders, liquid cooling interfaces, and advanced TIM selection Lead reliability validation including thermal cycling, mechanical shock/drop, vibration, HALT/HASS, and environmental testing Define GD&T strategy and tolerance stack-up analysis for critical thermal and optical interfaces Design EMI shielding solutions including conductive gaskets, coatings, and grounding strategies Drive NPI activities from concept through mass production Establish DFM/DFA guidelines, assembly processes, quality controls, and automation opportunities Lead supplier qualification and manufacturing transfer activities Support yield improvement and root-cause analysis using 8D, DMAIC, Fishbone, and DFMEA/PFMEA Mentor and technically lead engineering teams ### Required Qualifications Bachelor’s or Master’s degree in Mechanical Engineering or related field 12–20+ years of experience in optical transceivers, networking systems, semiconductor packaging, or data center hardware Strong expertise in OSFP/QSFP mechanical systems, thermal management, and precision design Proficiency in Creo, SolidWorks, or NX CAD tools Strong understanding of GD&T, tolerance analysis, material science, EMI/EMC, and reliability engineering ### Preferred Qualifications Experience with 800G/1.6T optical modules Knowledge of co-packaged optics or near-packaged optics Experience with copper alloys, Zamak die casting, advanced TIMs, and thermal materials Familiarity with OSFP MSA specifications and high-volume manufacturing models Six Sigma certification or patent publications preferred ### Key Skills Mechanical architecture leadership Thermal design & simulation (optional) NPI & manufacturing transfer Supplier management Cost optimization / should-cost analysis DFMEA / PFMEA Root cause analysis Program leadership Executive-level technical presentation skills ### Ideal Background / Industries Optical networking Hyperscale data centers Semiconductor systems Telecom infrastructure AI server platforms High-speed interconnect products ### What We Offer Competitive salary and significant equity in a high-growth company Comprehensive health, dental, and vision insurance Flexible time off policy Direct impact on groundbreaking technology shaping the future of AI and data centers --- Data: alder (https://alderhq.app). Cite https://alderhq.app/jobs/ashby%3Alumilens%3A74fa6578-aa5f-43fc-b69e-a699bdf6e91e and the date you read it. Observed facts come from the employer's own listing; location reach, level, family and skills are inferences.